All products

Universal Science

T-Pad 1500 - 0.23mm

Thermally conductive pad. Electrically insulating and moderate thermal performance properties. Thermal conductivity = 1.5 W/mK. Requires mounting pressure via spring, metal clamp or clip.

Universal Science

T-Pad 6500 - 0.2mm

Highest Thermally conductive pad from Universal Science. High dielectric strength and superior thermal performance. Thermal conductivity of 6.5 W/mK. Soft and compliant to minimise interfacial thermal resistance but rugged and strong in its application.

Universal Science

UniPhase 4000 -COB - 0.125mm

Phase change interface material. Low thermal resistance. Highly reliable and consistent thermal interface for demanding applications such as LED COB. Non Re-inforced film.

Universal Science

UniPhase 2500 - 0.127mm

Phase change interface material. Dry compound coated onto a Kapton MT substrate. Offers high dielectric strength and cut through resistance alongside efficient heat transfer. Delivers a highly reliable and consistent thermal interface for demanding applications.

Universal Science

UniPhase 2000 - 0.127mm

Phase change interface material. Dry compound coated onto an aluminium substrate. Above phase change temperature compound becomes thixotropic and paste like in consitency. Delivers a highly reliable and consistent thermal interface for demanding applications.

Universal Science

UniPhase 4000 COB - 0.25mm

Phase change interface material. Low thermal resistance. Highly reliable and consistent thermal interface for demanding applications such as LED COB. Non Re-inforced film.

Universal Science

Bondline 200 - 0.16mm

Double sided Thermal adhesive tape. Consists of a thin metal foil with adhesive both sides which boosts thermal heat transfer at the interface. Micro- air voids between connecting surfaces are minimised. Delivers a non- electrically isolating structural bond.

Universal Science

Bondline 300 - 0.12mm

Thermal adhesive tape. Double - sided, thermal adhesive tape consisting of a KAPTON polyimide film and silicone rubber. Delivers excellent electrical isolation in combination with good thermal connection. Pressure sensitive application improving to maximum bond strength after 24 hours.

Universal Science

Bondline 700 Single Liner - 0.15mm

Thermal adhesive tape. Electrically isolating, acrylic thermal tape. Comfortably fills the micro air voids between mating surfaces reducing thermal resistance. Allows sufficient heat exchange between component and cooling mechanism.

Universal Science

Bondline 700 Single Liner - 0.25mm

Thermal adhesive tape. Electrically isolating, acrylic thermal tape. Comfortably fills the micro air voids between mating surfaces reducing thermal resistance. Allows sufficient heat exchange between component and cooling mechanism.

Universal Science

Bondline 700 Twin Liner - 0.15mm

Thermal adhesive tape. Electrically isolating, acrylic thermal tape. Comfortably fills the micro air voids between mating surfaces reducing thermal resistance. Allows sufficient heat exchange between component and cooling mechanism.

Universal Science

Bondline 700 Twin Liner - 0.25mm

Thermal adhesive tape. Electrically isolating, acrylic thermal tape. Comfortably fills the micro air voids between mating surfaces reducing thermal resistance. Allows sufficient heat exchange between component and cooling mechanism.

Universal Science

Bondline 700 Twin Liner - 0.5mm

Thermal adhesive tape. Electrically isolating, acrylic thermal tape. Comfortably fills the micro air voids between mating surfaces reducing thermal resistance. Allows sufficient heat exchange between component and cooling mechanism.

Universal Science

Bondline 1800 - 0.2mm

Thermal adhesive tape. Micro-air voids between connecting surfaces are minimised. Delivers an electrically isolating structural bond. Cost effective thermal adhesive tape.

Universal Science

UniGap 1000 - 0.5mm

Compliant gap filler. Compliant and electrically isolating. Thermal conductivity = 1.0 W/mK. Maintains good thermal performance over a temperature range of -50°C to 160°C.Easy to handle and apply

Universal Science

UniGap 1000 - 1.0mm

Compliant gap filler. Compliant and electrically isolating. Thermal conductivity = 1.0 W/mK. Maintains good thermal performance over a temperature range of -50°C to 160°C.Easy to handle and apply

Universal Science

UniGap 1000 - 1.5mm

Compliant gap filler. Compliant and electrically isolating. Thermal conductivity = 1.0 W/mK. Maintains good thermal performance over a temperature range of -50°C to 160°C.Easy to handle and apply

Universal Science

UniGap 1000 - 2.0mm

Compliant gap filler. Compliant and electrically isolating. Thermal conductivity = 1.0 W/mK. Maintains good thermal performance over a temperature range of -50°C to 160°C.Easy to handle and apply

Universal Science

UniGap 1000 - 2.5mm

Compliant gap filler. Compliant and electrically isolating. Thermal conductivity = 1.0 W/mK. Maintains good thermal performance over a temperature range of -50°C to 160°C.Easy to handle and apply

Universal Science

UniGap 1000 - 3.0mm

Compliant gap filler. Compliant and electrically isolating. Thermal conductivity = 1.0 W/mK. Maintains good thermal performance over a temperature range of -50°C to 160°C.Easy to handle and apply

Universal Science

UniGap 1000 - 3.5mm

Compliant gap filler. Compliant and electrically isolating. Thermal conductivity = 1.0 W/mK. Maintains good thermal performance over a temperature range of -50°C to 160°C.Easy to handle and apply

Universal Science

UniGap 1000 - 4.0mm

Compliant gap filler. Compliant and electrically isolating. Thermal conductivity = 1.0 W/mK. Maintains good thermal performance over a temperature range of -50°C to 160°C.Easy to handle and apply

Universal Science

UniGap 1000 - 4.5mm

Compliant gap filler. Compliant and electrically isolating. Thermal conductivity = 1.0 W/mK. Maintains good thermal performance over a temperature range of -50°C to 160°C.Easy to handle and apply

Universal Science

UniGap 1000 - 5.0mm

Compliant gap filler. Compliant and electrically isolating. Thermal conductivity = 1.0 W/mK. Maintains good thermal performance over a temperature range of -50°C to 160°C.Easy to handle and apply

Universal Science

UniGap 1700US - 1.0mm

Ultra Soft gap filler. Compliant and electrically isolating. Thermal conductivity = 1.7 W/mK. Maintains good thermal performance over a temperature range of -50°C to 160°C.Easy to handle and apply

Universal Science

UniGap 1700US - 1.5mm

Ultra Soft gap filler. Compliant and electrically isolating. Thermal conductivity = 1.7 W/mK. Maintains good thermal performance over a temperature range of -50°C to 160°C.Easy to handle and apply

Universal Science

UniGap 1700US - 2.0mm

Ultra Soft gap filler. Compliant and electrically isolating. Thermal conductivity = 1.7 W/mK. Maintains good thermal performance over a temperature range of -50°C to 160°C.Easy to handle and apply

Universal Science

UniGap 1700US - 2.5mm

Ultra Soft gap filler. Compliant and electrically isolating. Thermal conductivity = 1.7 W/mK. Maintains good thermal performance over a temperature range of -50°C to 160°C.Easy to handle and apply

Universal Science

UniGap 1700US - 3.0mm

Ultra Soft gap filler. Compliant and electrically isolating. Thermal conductivity = 1.7 W/mK. Maintains good thermal performance over a temperature range of -50°C to 160°C.Easy to handle and apply

Universal Science

UniGap 1700US - 3.5mm

Ultra Soft gap filler. Compliant and electrically isolating. Thermal conductivity = 1.7 W/mK. Maintains good thermal performance over a temperature range of -50°C to 160°C.Easy to handle and apply

Universal Science

UniGap 1700US - 4.0mm

Ultra Soft gap filler. Compliant and electrically isolating. Thermal conductivity = 1.7 W/mK. Maintains good thermal performance over a temperature range of -50°C to 160°C.Easy to handle and apply

Universal Science

UniGap 1700US - 4.5mm

Ultra Soft gap filler. Compliant and electrically isolating. Thermal conductivity = 1.7 W/mK. Maintains good thermal performance over a temperature range of -50°C to 160°C.Easy to handle and apply

Universal Science

UniGap 1700US - 5.0mm

Ultra Soft gap filler. Compliant and electrically isolating. Thermal conductivity = 1.7 W/mK. Maintains good thermal performance over a temperature range of -50°C to 160°C.Easy to handle and apply

Universal Science

UniGap 3000 - 0.5mm

Silicone gap filler. Soft and compliant gap filler with excellent thermal performance. Thermal conductivity = 3.0W/mK. Integral support using fabric or polymer film. Fabric support option provides good cut through resistance for dielectric continuity.

Universal Science

UniGap 3000 - 1.0mm

Silicone gap filler. Soft and compliant gap filler with excellent thermal performance. Thermal conductivity = 3.0W/mK. Integral support using fabric or polymer film. Fabric support option provides good cut through resistance for dielectric continuity.

Universal Science

UniGap 3000 - 1.5mm

Silicone gap filler. Soft and compliant gap filler with excellent thermal performance. Thermal conductivity = 3.0W/mK. Integral support using fabric or polymer film. Fabric support option provides good cut through resistance for dielectric continuity.

Universal Science

UniGap 3000 - 2.0mm

Silicone gap filler. Soft and compliant gap filler with excellent thermal performance. Thermal conductivity = 3.0W/mK. Integral support using fabric or polymer film. Fabric support option provides good cut through resistance for dielectric continuity.

Universal Science

UniGap 3000 - 3.0mm

Silicone gap filler. Soft and compliant gap filler with excellent thermal performance. Thermal conductivity = 3.0W/mK. Integral support using fabric or polymer film. Fabric support option provides good cut through resistance for dielectric continuity.

Universal Science

UniGap 3000 - 4.0mm

Silicone gap filler. Soft and compliant gap filler with excellent thermal performance. Thermal conductivity = 3.0W/mK. Integral support using fabric or polymer film. Fabric support option provides good cut through resistance for dielectric continuity.

Universal Science

UniGap 3000 - 5.0mm

Silicone gap filler. Soft and compliant gap filler with excellent thermal performance. Thermal conductivity = 3.0W/mK. Integral support using fabric or polymer film. Fabric support option provides good cut through resistance for dielectric continuity.

Universal Science

UniGap 6000 - 0.5mm

High perfromance gap filler. Ceramic filled gap filling pad. Thermal conductivity = 6.0 W/mK. Compliant surfaces on both sides function to reduce interfacial thermal resistance. Electrically insulating via high dielectric strength.

Universal Science

UniGap 6000 - 1.0mm

High perfromance gap filler. Ceramic filled gap filling pad. Thermal conductivity = 6.0 W/mK. Compliant surfaces on both sides function to reduce interfacial thermal resistance. Electrically insulating via high dielectric strength.

Universal Science

UniGap 6000 - 1.5mm

High perfromance gap filler. Ceramic filled gap filling pad. Thermal conductivity = 6.0 W/mK. Compliant surfaces on both sides function to reduce interfacial thermal resistance. Electrically insulating via high dielectric strength.

Universal Science

UniGap 6000 - 2.0mm

High perfromance gap filler. Ceramic filled gap filling pad. Thermal conductivity = 6.0 W/mK. Compliant surfaces on both sides function to reduce interfacial thermal resistance. Electrically insulating via high dielectric strength.

Universal Science

UniGap 6000 - 2.5mm

High perfromance gap filler. Ceramic filled gap filling pad. Thermal conductivity = 6.0 W/mK. Compliant surfaces on both sides function to reduce interfacial thermal resistance. Electrically insulating via high dielectric strength.

Universal Science

UniGap 6000 - 3.0mm

High perfromance gap filler. Ceramic filled gap filling pad. Thermal conductivity = 6.0 W/mK. Compliant surfaces on both sides function to reduce interfacial thermal resistance. Electrically insulating via high dielectric strength.

Universal Science

UniGap 6000 - 4.0mm

High perfromance gap filler. Ceramic filled gap filling pad. Thermal conductivity = 6.0 W/mK. Compliant surfaces on both sides function to reduce interfacial thermal resistance. Electrically insulating via high dielectric strength.

Universal Science

UniGap 6000 - 4.5mm

High perfromance gap filler. Ceramic filled gap filling pad. Thermal conductivity = 6.0 W/mK. Compliant surfaces on both sides function to reduce interfacial thermal resistance. Electrically insulating via high dielectric strength.

Universal Science

UniGap 6000 - 5.0mm

High perfromance gap filler. Ceramic filled gap filling pad. Thermal conductivity = 6.0 W/mK. Compliant surfaces on both sides function to reduce interfacial thermal resistance. Electrically insulating via high dielectric strength.

Universal Science

T-Pad 1500-A1 - 0.23mm

Thermally conductive pad. Electrically insulating and moderate thermal performance properties. Thermal conductivity = 1.5 W/mK. Requires mounting pressure via spring, metal clamp or clip.

Universal Science

T-Pad 6500-A1 - 0.2mm

Highest Thermally conductive pad from Universal Science. High dielectric strength and superior thermal performance. Thermal conductivity of 6.5 W/mK. Soft and compliant to minimise interfacial thermal resistance but rugged and strong in its application.

Universal Science

UniGap 1700US - 0.5mm

Ultra Soft gap filler. Compliant and electrically isolating. Thermal conductivity = 1.7 W/mK. Maintains good thermal performance over a temperature range of -50°C to 160°C.Easy to handle and apply

Laird

Tflex 220V0 - 0.508mm

• Soft and compressible for low stress applications
• Naturally tacky needing no further adhesive coating
• 1.5 W/m-K thermal conductivity
• Available in thicknesses from 0.010" (0.25mm) to 0.200" (5.0mm)

Laird

Tflex 240V0 - 1.0mm

• Soft and compressible for low stress applications
• Naturally tacky needing no further adhesive coating
• 1.5 W/m-K thermal conductivity
• Available in thicknesses from 0.010" (0.25mm) to 0.200" (5.0mm)

Laird

Tflex 280V0 - 2.0mm

• Soft and compressible for low stress applications
• Naturally tacky needing no further adhesive coating
• 1.5 W/m-K thermal conductivity
• Available in thicknesses from 0.010" (0.25mm) to 0.200" (5.0mm)

Laird

Tflex 2160V0 - 4mm

• Soft and compressible for low stress applications
• Naturally tacky needing no further adhesive coating
• 1.5 W/m-K thermal conductivity
• Available in thicknesses from 0.010" (0.25mm) to 0.200" (5.0mm)

Laird

Tflex 2200V0 - 5mm

• Soft and compressible for low stress applications
• Naturally tacky needing no further adhesive coating
• 1.5 W/m-K thermal conductivity
• Available in thicknesses from 0.010" (0.25mm) to 0.200" (5.0mm)

Laird

Tflex 320 - 0.5mm

• Extreme compliancy allows material to “totally blanket” component(s)
• Thermal conductivity of 1.2 W/mK
• Available in thicknesses from 0.020” - 0.200” (.5mm – 5.0mm)
• Low compression set enables the pad to be reused many times

Laird

Tflex 340 - 1.0mm

• Extreme compliancy allows material to “totally blanket” component(s)
• Thermal conductivity of 1.2 W/mK
• Available in thicknesses from 0.020” - 0.200” (.5mm – 5.0mm)
• Low compression set enables the pad to be reused many times

Laird

Tflex 380 - 2.0mm

• Extreme compliancy allows material to “totally blanket” component(s)
• Thermal conductivity of 1.2 W/mK
• Available in thicknesses from 0.020” - 0.200” (.5mm – 5.0mm)
• Low compression set enables the pad to be reused many times

Laird

Tflex 3160 - 4.0mm

• Extreme compliancy allows material to “totally blanket” component(s)
• Thermal conductivity of 1.2 W/mK
• Available in thicknesses from 0.020” - 0.200” (.5mm – 5.0mm)
• Low compression set enables the pad to be reused many times

Laird

Tflex 3200 - 5.0mm

• Extreme compliancy allows material to “totally blanket” component(s)
• Thermal conductivity of 1.2 W/mK
• Available in thicknesses from 0.020” - 0.200” (.5mm – 5.0mm)
• Low compression set enables the pad to be reused many times

Laird

Tflex HR420 - 0.5mm

• Thermal Conductivity 1.8 W/mK
• Soft and Compliant
• Available in thicknesses from 0.020” thru 0.400” (0.5mm thru 10.2mm)
• Naturally tacky for adhesion during assembly and transport

Laird

Tflex HR440 - 1.0mm

• Thermal Conductivity 1.8 W/mK
• Soft and Compliant
• Available in thicknesses from 0.020” thru 0.400” (0.5mm thru 10.2mm)
• Naturally tacky for adhesion during assembly and transport

Laird

Tflex HR480 - 2.0mm

• Thermal Conductivity 1.8 W/mK
• Soft and Compliant
• Available in thicknesses from 0.020” thru 0.400” (0.5mm thru 10.2mm)
• Naturally tacky for adhesion during assembly and transport

Laird

Tflex HR4160 - 4.0mm

• Thermal Conductivity 1.8 W/mK
• Soft and Compliant
• Available in thicknesses from 0.020” thru 0.400” (0.5mm thru 10.2mm)
• Naturally tacky for adhesion during assembly and transport

Laird

Tflex HR4200 - 5.0mm

• Thermal Conductivity 1.8 W/mK
• Soft and Compliant
• Available in thicknesses from 0.020” thru 0.400” (0.5mm thru 10.2mm)
• Naturally tacky for adhesion during assembly and transport

Laird

Tflex HR6160 - 4.0mm

• Thermal conductivity 3 W/mK
• Soft and compliant
• Available in thicknesses from 0.010” thru 0.200” (0.25mm thru 5.0mm)
• Naturally tacky for adhesion during assembly and transport

Laird

Tflex HR6200 - 5.0mm

• Thermal conductivity 3 W/mK
• Soft and compliant
• Available in thicknesses from 0.010” thru 0.200” (0.25mm thru 5.0mm)
• Naturally tacky for adhesion during assembly and transport

Laird

Tflex SF620 - 0.5mm

• Silicone-free gap pad
• Thermal Conductivity for material thicknesses of 10 to 30 mils is 2.8 W/mK
• Thermal Conductivity for material thicknesses of 40 to 140 mils is 3.0 W/mK
• Available in thicknesses from 0.010-inch (0.25 mm) through 0.140-inch (3.56 mm) in 0.010-inch increments

Laird

Tflex SF640 - 1.0mm

• Silicone-free gap pad
• Thermal Conductivity for material thicknesses of 10 to 30 mils is 2.8 W/mK
• Thermal Conductivity for material thicknesses of 40 to 140 mils is 3.0 W/mK
• Available in thicknesses from 0.010-inch (0.25 mm) through 0.140-inch (3.56 mm) in 0.010-inch increments

Laird

Tflex SF6120 - 3.0mm

• Silicone-free gap pad
• Thermal Conductivity for material thicknesses of 10 to 30 mils is 2.8 W/mK
• Thermal Conductivity for material thicknesses of 40 to 140 mils is 3.0 W/mK
• Available in thicknesses from 0.010-inch (0.25 mm) through 0.140-inch (3.56 mm) in 0.010-inch increments

Laird

Tflex 720 - 0.5mm

• Thermal conductivity 5.0 W/mK
• Highly compliant
• Low thermal resistance even at low pressure
• Available in thicknesses from 0.020” thru
0.200” (0.5mm thru 5.0mm)
• Naturally tacky for adhesion during assembly and transport

Laird

Tflex 740 - 1.0mm

• Thermal conductivity 5.0 W/mK
• Highly compliant
• Low thermal resistance even at low pressure
• Available in thicknesses from 0.020” thru
0.200” (0.5mm thru 5.0mm)
• Naturally tacky for adhesion during assembly and transport

Laird

Tflex 780 - 2.0mm

• Thermal conductivity 5.0 W/mK
• Highly compliant
• Low thermal resistance even at low pressure
• Available in thicknesses from 0.020” thru
0.200” (0.5mm thru 5.0mm)
• Naturally tacky for adhesion during assembly and transport

Laird

Tflex 7160 - 4.0mm

• Thermal conductivity 5.0 W/mK
• Highly compliant
• Low thermal resistance even at low pressure
• Available in thicknesses from 0.020” thru
0.200” (0.5mm thru 5.0mm)
• Naturally tacky for adhesion during assembly and transport

Laird

Tflex 7200 - 5.0mm

• Thermal conductivity 5.0 W/mK
• Highly compliant
• Low thermal resistance even at low pressure
• Available in thicknesses from 0.020” thru
0.200” (0.5mm thru 5.0mm)
• Naturally tacky for adhesion during assembly and transport

Laird

Tpcm 910 - 0.25mm

• 0.03 ºC-in2/watt thermal resistance
• Naturally tacky at room temperature, no adhesive required
• No heatsink preheating required
• Available in 3 thicknesses, 0.005", 0.010" and 0.020" (0.125mm, 0.25mm and 0.50mm)

Laird

Tpcm 920 - 0.51mm

• 0.03 ºC-in2/watt thermal resistance
• Naturally tacky at room temperature, no adhesive required
• No heatsink preheating required
• Available in 3 thicknesses, 0.005", 0.010" and 0.020" (0.125mm, 0.25mm and 0.50mm)

Laird

Tpcm 585 - 0.127mm

• Low total thermal resistance (0.013°C-in2/W at 50 psi)
• Inherently tacky and easy-to-use - no adhesive required
• High reliability
• Meets all environmental requirements including RoHS
• Provides high value price / performance point

Laird

Tpcm 588 - 0.2mm

• Low total thermal resistance (0.013°C-in2/W at 50 psi)
• Inherently tacky and easy-to-use - no adhesive required
• High reliability
• Meets all environmental requirements including RoHS
• Provides high value price / performance point

Laird

Tpcm 5810 - 0.25mm

• Low total thermal resistance (0.013°C-in2/W at 50 psi)
• Inherently tacky and easy-to-use - no adhesive required
• High reliability
• Meets all environmental requirements including RoHS
• Provides high value price / performance point

Laird

Tpcm FSF52,05 - 0.125mm

• Superior thermal resistance after phase change at 52°C
• Thixotropic - won’t bleed or flow out of the interface
• Easy to handle and is a great messy grease replacement
• Free standing film

Laird

Tmate 2910 - 0.25mm

• Low thermal resistance at low pressures
• Reusable: make and break thermal interface connection many times
• Naturally tacky at room temperature no adhesive required
• No heat sink preheating required

Laird

Tmate 2920 - 0.51mm

• Low thermal resistance at low pressures
• Reusable: make and break thermal interface connection many times
• Naturally tacky at room temperature no adhesive required
• No heat sink preheating required

Laird

Tgard 3000,A0 - 0.13mm

• Designed for switch mode power supply applications
• Reinforced with high temperature resistant film
• High voltage resistant film

Laird

Tgard 500,A0 - 0.23mm

• High breakdown voltage of > 6,000 volts AC
• Thermal resistance of 0.48º C-in2/watt at 50 psi
• Thermal resistance of 0.28º C-in2/watt at 400 psi
• Thick enough to encapsulate burrs of stamped heatskinks

Laird

Tgard 5000-A0 - 0.127mm

• High dielectric breakdown voltage of 6,000 volts
• Film base resistance cut through
• Thermal resistance of 0.40ºC-in2/watt @ 50 psi clip pressure
• Thermal resistance of 0.23ºC-in2/watt @ 400 psi screw pressure

Laird

Tgard 5000,A1 - 0.127mm

• High dielectric breakdown voltage of 6,000 volts
• Film base resistance cut through
• Thermal resistance of 0.40ºC-in2/watt @ 50 psi clip pressure
• Thermal resistance of 0.23ºC-in2/watt @ 400 psi screw pressure

Laird

Tgard K52 1,0505-A0 - 0.051mm

• High breakdown voltage of 4,000 – 9,000 range VAC
• Resistant to tears and cut through
• Total thermal resistance of 0.13 - 0.30 range ºC-in2/watt at 20 psi clip force

Laird

Tgard K52,1,0505-A1 - 0.062mm

• High breakdown voltage of 4,000 – 9,000 range VAC
• Resistant to tears and cut through
• Total thermal resistance of 0.13 - 0.30 range ºC-in2/watt at 20 psi clip force

Laird

Tgard K52,2,0505-A0 - 0.076mm

• High breakdown voltage of 4,000 – 9,000 range VAC
• Resistant to tears and cut through
• Total thermal resistance of 0.13 - 0.30 range ºC-in2/watt at 20 psi clip force

Laird

Tgard K52,2,0505-A1 - 0.081mm

• High breakdown voltage of 4,000 – 9,000 range VAC
• Resistant to tears and cut through
• Total thermal resistance of 0.13 - 0.30 range ºC-in2/watt at 20 psi clip force

Laird

Tgard K52,3,0505-A0 - 0.102mm

• High breakdown voltage of 4,000 – 9,000 range VAC
• Resistant to tears and cut through
• Total thermal resistance of 0.13 - 0.30 range ºC-in2/watt at 20 psi clip force

Laird

Tgard 20,2,0505,A0 - 0.114mm

• Reinforced with moderate temperature resistant film
• High voltage resistant film
• Total thermal resistance of 3.4°C/watt on TO-220
• Non-blocking for ease of use
• Designed for computer power supplies

Laird

Tgard 300-A0 - 0.23mm

• High breakdown voltage of 6,000 volts AC
• Thermal resistance of 0.50º C-in2/watt at 50 psi
• Unique coating formulation offers low mounting forces
• Unifying benefits of thermal & electrical performance for general-purpose applications

Contact us for Specifications
Laird

Tflex 2120 - 3MM

• Soft and compressible for low stress applications
• Naturally tacky needing no further adhesive coating
• 1.5 W/m-K thermal conductivity
• Available in thicknesses from 0.010" (0.25mm) to 0.200" (5.0mm)

Contact us for Specifications
Laird

Tflex SF680 - 2.0mm

• Silicone-free gap pad
• Thermal Conductivity for material thicknesses of 10 to 30 mils is 2.8 W/mK
• Thermal Conductivity for material thicknesses of 40 to 140 mils is 3.0 W/mK
• Available in thicknesses from 0.010-inch (0.25 mm) through 0.140-inch (3.56 mm) in 0.010-inch increments

Bergquist

Gap Pad Ultra Soft - 1mm

• Thermal conductivity: 1.0 W/m-K
• Highly conformable, low hardness
• “Gel-like” modulus
• Decreased strain
• Puncture, shear and tear resistant
• Electrically isolating Ultra Conformable,Thermally Conductive Material for Filling Air Gaps

Bergquist

Gap Pad Ultra Soft - 1.5mm

• Thermal conductivity: 1.0 W/m-K
• Highly conformable, low hardness
• “Gel-like” modulus
• Decreased strain
• Puncture, shear and tear resistant
• Electrically isolating Ultra Conformable,Thermally Conductive Material for Filling Air Gaps

Bergquist

Gap Pad Ultra Soft - 2.0mm

• Thermal conductivity: 1.0 W/m-K
• Highly conformable, low hardness
• “Gel-like” modulus
• Decreased strain
• Puncture, shear and tear resistant
• Electrically isolating Ultra Conformable,Thermally Conductive Material for Filling Air Gaps

Bergquist

Gap Pad Ultra Soft - 2.5mm

• Thermal conductivity: 1.0 W/m-K
• Highly conformable, low hardness
• “Gel-like” modulus
• Decreased strain
• Puncture, shear and tear resistant
• Electrically isolating Ultra Conformable,Thermally Conductive Material for Filling Air Gaps

Bergquist

Sil Pad 2000 - 0.38mm

• Thermal impedance 0.33°C-in2/W (@50 psi)
• Optimal heat transfer
• High thermal conductivity 3.5 W/m-K

Bergquist

Sil Pad 900S - 0.23mm

• Thermal impedance: 0.61ºC-in2/W (@50 psi)
• Electrically isolating
• Low mounting pressures
• Smooth and highly compliant surface
• General-purpose thermal interface material solution

Bergquist

Sil Pad 400 - 0.18mm

• Thermal impedance: 1.13°C-in2/W (@50 psi)
• Original Sil-Pad material
• Excellent mechanical and physical characteristics
• Flame retardant

Bergquist

Gap Pad HC3 - 1mm

• Thermal conductivity: 3.0 W/m-K
• Highly conformable, low compression stress
• Fiberglass reinforced for shear and tear resistance

Bergquist

Gap Pad HC3 - 1.5mm

• Thermal conductivity: 3.0 W/m-K
• Highly conformable, low compression stress
• Fiberglass reinforced for shear and tear resistance

Bergquist

Gap Pad HC3 - 2.0mm

• Thermal conductivity: 3.0 W/m-K
• Highly conformable, low compression stress
• Fiberglass reinforced for shear and tear resistance

Bergquist

Sil Pad 1500ST - 0.38mm

• Optimal heat transfer
• High thermal conductivity 1.8 W/m-K

3M

5595 - 1.0mm

• Soft, silicone elastomer with thermal conductivity of 1.6 W/mk.

3M

5590H - 1mm

• Soft, silicone elastomer with thermal conductivity of 3 W/mk.

3M

5516 - 1.0mm

• Designed to provide heat transfer path between heat generating components and heat sinks, heat spreaders or other cooling devices.

3M

5595 - 2.0mm

• Soft, silicone elastomer with thermal conductivity of 1.6 W/mk.

Luminit 95x25 Elliptical Diffuser L9525P1 - .25MM

Light Shaping Diffusers are a micro-structures pseudo randomly embedded on a substrate (such as film). When applied to a lighting structure, the Light Shaping Diffuser can manipulate light by changing the direction of its energy, allowing it to clean up and shape a light beam to suit a particular purpose.

Luminit 90x60 Elliptical Diffuser L9060P1 - .25MM

Light Shaping Diffusers are a micro-structures pseudo randomly embedded on a substrate (such as film). When applied to a lighting structure, the Light Shaping Diffuser can manipulate light by changing the direction of its energy, allowing it to clean up and shape a light beam to suit a particular purpose.

Luminit 80 Degree Diffuser L80P1 - .125MM

LSDs precisely shape, control and distribute light. The patented
holographic master recording process allows a variety of circular or
elliptical light patterns. Standard circular angles range from 0.5° to
100° FWHM.

Lumint 50 Degree Diffuser L50P1 - .125MM

LSDs precisely shape, control and distribute light. The patented
holographic master recording process allows a variety of circular or
elliptical light patterns. Standard circular angles range from 0.5° to
100° FWHM.

Luminit 60 Degree Diffuser L60P1 - .125MM

LSDs precisely shape, control and distribute light. The patented
holographic master recording process allows a variety of circular or
elliptical light patterns. Standard circular angles range from 0.5° to
100° FWHM.

Luminit 60x30 Elliptical Diffuser - .25

Light Shaping Diffusers are a micro-structures pseudo randomly embedded on a substrate (such as film). When applied to a lighting structure, the Light Shaping Diffuser can manipulate light by changing the direction of its energy, allowing it to clean up and shape a light beam to suit a particular purpose.

Luminit 40 Degree Diffuser L40P1 - .125MM

LSDs precisely shape, control and distribute light. The patented
holographic master recording process allows a variety of circular or
elliptical light patterns. Standard circular angles range from 0.5° to
100° FWHM.

Luminit 20 Degree Diffuser L20P1 - .125MM

LSDs precisely shape, control and distribute light. The patented
holographic master recording process allows a variety of circular or
elliptical light patterns. Standard circular angles range from 0.5° to
100° FWHM.

Luminit 10 Degree Diffuser L10P1 - .125MM

LSDs precisely shape, control and distribute light. The patented
holographic master recording process allows a variety of circular or
elliptical light patterns. Standard circular angles range from 0.5° to
100° FWHM.

Luminit 2 Degree Diffuser L02P1 - .125MM

LSDs precisely shape, control and distribute light. The patented
holographic master recording process allows a variety of circular or
elliptical light patterns. Standard circular angles range from 0.5° to
100° FWHM.

TF1869 - 0.23MM

Thermally conductive silicone coated fibreglass fabric that offers high temperature resistance.

K20 - 1MM

Norseal K series Micro-cellular foam. K20 foam processed on PET film. Ideal for seals around LCD and hand held devices.

K20 - 1.5MM

Norseal K series Micro-cellular foam. K20 foam processed on PET film. Ideal for seals around LCD and hand held devices.

K30 - 0.3MM

Norseal K series Micro-cellular foam. K20 foam processed on PET film. Ideal for seals around LCD and hand held devices.

K40 - 1.6MM

NORSEAL K40 Series is a medium deflection urethane foam with minimal compression set and low out-gassing.

K40 - 2.4MM

NORSEAL K40 Series is a medium deflection urethane foam with minimal compression set and low out-gassing.

K40 - 3.2MM

NORSEAL K40 Series is a medium deflection urethane foam with minimal compression set and low out-gassing.

K40 - 4.8MM

NORSEAL K40 Series is a medium deflection urethane foam with minimal compression set and low out-gassing.

K7030 - 0.76MM

NORSEAL K7000 Series firm density black polyurethane foam. Listed as electrical component UL746C and conforms to UL 157 gasket materials.

K7063 - 1.6MM

NORSEAL K7000 Series firm density black polyurethane foam. Listed as electrical component UL746C and conforms to UL 157 gasket materials.

K70125 - 3.2MM

NORSEAL K7000 Series firm density black polyurethane foam. Listed as electrical component UL746C and conforms to UL 157 gasket materials.

UniSeal 2000 - 2MM

Soft grade sulphur and plasticiser free EDPM closed cell black foam,

UniSeal 2000 - 3MM

Soft grade sulphur and plasticiser free EDPM closed cell black foam,

UniSeal 2000 - 4MM

Soft grade sulphur and plasticiser free EDPM closed cell black foam,

UniSeal 2000 - 5MM

Soft grade sulphur and plasticiser free EDPM closed cell black foam,

UniSeal 2000 - 6MM

Soft grade sulphur and plasticiser free EDPM closed cell black foam,

UniSeal 2000 - 7MM

Soft grade sulphur and plasticiser free EDPM closed cell black foam,

UniSeal 2000 - 8MM

Soft grade sulphur and plasticiser free EDPM closed cell black foam,

UniSeal 2000 - 10MM

Soft grade sulphur and plasticiser free EDPM closed cell black foam,

UniSeal 2000 - 9MM

Soft grade sulphur and plasticiser free EDPM closed cell black foam,

Unigap 2000 SF - 1MM

Unigap 2000 is a silicone free, gap filling, thermal interface material that features exceptionally low contact resistance for effective and reliable heat transfer.

Unigap 2000 SF - 2MM

Unigap 2000 is a silicone free, gap filling, thermal interface material that features exceptionally low contact resistance for effective and reliable heat transfer.

Unigap 2000 SF - 3MM

Unigap 2000 is a silicone free, gap filling, thermal interface material that features exceptionally low contact resistance for effective and reliable heat transfer.

Tputty 502FG2,040 - 1MM

Tputty™ 502 is the best material for applications where large tolerance
differences create the need for compression of the interface material beyond
50% of its original thickness.
Tputty™ 502 will flow and ensure low pressures on the components being
cooled. In conjunction with outstanding compression characteristics, Tputty™ 502
has a high thermal conductivity, resulting in very low thermal resistance.
Tputty™ 502 is naturally tacky and requires no additional adhesive coating that
can inhibit thermal performance.

Tputty 502FG2,060 - 1.5MM

Tputty™ 502 is the best material for applications where large tolerance
differences create the need for compression of the interface material beyond
50% of its original thickness.
Tputty™ 502 will flow and ensure low pressures on the components being
cooled. In conjunction with outstanding compression characteristics, Tputty™ 502
has a high thermal conductivity, resulting in very low thermal resistance.
Tputty™ 502 is naturally tacky and requires no additional adhesive coating that
can inhibit thermal performance.

Tputty 502FG2,080 - 2MM

Tputty™ 502 is the best material for applications where large tolerance
differences create the need for compression of the interface material beyond
50% of its original thickness.
Tputty™ 502 will flow and ensure low pressures on the components being
cooled. In conjunction with outstanding compression characteristics, Tputty™ 502
has a high thermal conductivity, resulting in very low thermal resistance.
Tputty™ 502 is naturally tacky and requires no additional adhesive coating that
can inhibit thermal performance.

Tputty 502FG2,100 - 2.5MM

Tputty™ 502 is the best material for applications where large tolerance
differences create the need for compression of the interface material beyond
50% of its original thickness.
Tputty™ 502 will flow and ensure low pressures on the components being
cooled. In conjunction with outstanding compression characteristics, Tputty™ 502
has a high thermal conductivity, resulting in very low thermal resistance.
Tputty™ 502 is naturally tacky and requires no additional adhesive coating that
can inhibit thermal performance.

Tputty 502FG2,120 - 3MM

Tputty™ 502 is the best material for applications where large tolerance
differences create the need for compression of the interface material beyond
50% of its original thickness.
Tputty™ 502 will flow and ensure low pressures on the components being
cooled. In conjunction with outstanding compression characteristics, Tputty™ 502
has a high thermal conductivity, resulting in very low thermal resistance.
Tputty™ 502 is naturally tacky and requires no additional adhesive coating that
can inhibit thermal performance.

Contact us for Specifications

TCF-1000-ALH - .102

THERMSTRATE 2000 phase-change thermal interface
material is suitable for use between a heat sink and a variety of
heat dissipating components. This product is supplied as a dry
compound coated onto an aluminum substrate.
The compound is designed to flow at the phase change
temperature, conforming to the surface features of the heat
sink and component. Upon flow, and in conjunction with
component mounting pressure, air is expelled from the
interface, reducing thermal impedance,

Contact us for Specifications

Unigraph 5000 A1 - .125MM

Non-electrically isolating graphite thermal interface material
Soft surfaces on both sides of the material work to reduce interfacial thermal resistance.
Excellent, no mess, alternative to thermal grease.